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proteanTecs Joins UCIe (Universal Chiplet Interconnect Express) Consortium to Advance 2.5D/3D Interconnect Monitoring

Brings expertise in performance and reliability monitoring of die-to-die interfaces to the growing UCIe open chiplet ecosystem HAIFA, Israel, Sept. 20, 2022 /PRNewswire/ proteanTecs ....

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proteanTecs Joins UCIe™ (Universal Chiplet Interconnect Express™) Consortium to Advance 2.5D/3D Interconnect Monitoring

/PRNewswire/ proteanTecs, a global leader of deep data analytics for advanced electronics, has joined the UCIe™ (Universal Chiplet Interconnect Express™). ....

United States , New Jersey , Debendra Das Sharma , Evelyn Landman , Tamar Naishlos , Intel Corporation , Microsoft Corporation , Ucie Consortium , Samsung Electronics , Taiwan Semiconductor Manufacturing Company , Semiconductor Engineering Inc , Qualcomm Incorporated , Alibaba Group , Universal Chiplet Interconnect Express , Advanced Semiconductor Engineering , Google Cloud , Taiwan Semiconductor Manufacturing , Board Chair , High End Performance Packaging , Universal Chip Telemetry , Media Relations ,

proteanTecs Joins UCIe™ (Universal Chiplet Interconnect Express™) Consortium to Advance 2.5D/3D Interconnect Monitoring

/PRNewswire/ proteanTecs, a global leader of deep data analytics for advanced electronics, has joined the UCIe™ (Universal Chiplet Interconnect Express™). ....

United States , New Jersey , Debendra Das Sharma , Evelyn Landman , Intel Corporation , Microsoft Corporation , Ucie Consortium , Samsung Electronics , Semiconductor Engineering Inc , Qualcomm Incorporated , Taiwan Semiconductor Manufacturing Company , Alibaba Group , Universal Chiplet Interconnect Express , Advanced Semiconductor Engineering , Google Cloud , Taiwan Semiconductor Manufacturing , Board Chair , High End Performance Packaging , Universal Chip Telemetry ,

SEMI 3D & Systems Summit to Spotlight Trends in High-Performance, Energy-Efficient Applications

SEMI 3D & Systems Summit to Spotlight Trends in High-Performance, Energy-Efficient Applications
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