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Taiwan's semiconductor supply chain has "fine-tuned" production plans for a major artificial intelligence (AI) chip client in order to satisfy demand in time, according to industry sources.
Advanced Semiconductor Engineering (ASE) has announced its latest fan-out-chip-on-substrate-bridge (FOCoS-Bridge) technology innovation, which involved qualifying a large 70x78mm package containing two ASICs and eight HBM devices connected by eight silicon bridges.
Kioxia has begun operating two new R&D facilities in Japan - the Flagship Building at the Yokohama Technology Campus and the Shin-Koyasu Technology Front - bolstering the company's R&D capabilities in flash memory and solid-state drives (SSD), according to the company. In the future, other R&D functions in Kanagawa Prefecture will be relocated to these new R&D centers in order to increase research efficiency and advance technological innovation.
Broadcom said it also hopped on the bandwagon of the AI boom, predicting its AI revenue share would more than double in the coming years.
MediaTek is partnering with Nvidia to boost its competitiveness in the automotive IC market versus Qualcomm, but Qualcomm believes its extended deployment in the industry will keep it competitive.