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STMicroelectronics & Geely signed SiC supply deal for electric vehicles, also collaborating on solutions for automotive electronics & new energy vehicles.
Nvidia Corp (NASDAQ:NVDA) plans to use Fan-Out Panel Level Packaging (FOPLP) technology for its GB200 AI server chips earlier than scheduled to address the production constraints of Chip on Wafer on Substrate (CoWoS) packaging at Taiwan Semiconductor Manufacturing Co (NYSE:TSM). Industry insiders see FOPLP as a viable alternative to CoWoS due to TSMC’s limited CoWoS capacity and the rising demand for AI chips driven by generative AI applications. A senior executive from China Wafer Level CSP sta
NVDA plans to use FOPLP for AI server chips to address production constraints at TSMC. Industry sees FOPLP as a viable alternative to CoWoS.
Advanced Micro Devices, Inc (NASDAQ:AMD) claims it holds a 33% share in the server CPU market as it prepares to launch its next-gen “Turin” processors and unveils a GPU roadmap following the MI300 product line, the Register reports. During the JP Morgan Global Technology, Media, and Communications conference, Jean Hu, AMD’s CFO, highlighted the company’s growth in servers, CPUs, and GPUs. The stock is trading higher on Tuesday. She noted AMD’s partnerships, such as with Microsoft Corp (NASDAQ:MS