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STMicroelectronics & Geely signed SiC supply deal for electric vehicles, also collaborating on solutions for automotive electronics & new energy vehicles.
Nvidia Corp (NASDAQ:NVDA) plans to use Fan-Out Panel Level Packaging (FOPLP) technology for its GB200 AI server chips earlier than scheduled to address the production constraints of Chip on Wafer on Substrate (CoWoS) packaging at Taiwan Semiconductor Manufacturing Co (NYSE:TSM). Industry insiders see FOPLP as a viable alternative to CoWoS due to TSMC’s limited CoWoS capacity and the rising demand for AI chips driven by generative AI applications. A senior executive from China Wafer Level CSP sta
NVDA plans to use FOPLP for AI server chips to address production constraints at TSMC. Industry sees FOPLP as a viable alternative to CoWoS.
RSST, a potential alternative to JEPI ETF, offers a 13.5% yield with lower volatility. Read more to see why RSST ETF is a Strong Buy.
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Global X SuperDividend US ETF and Simplify Volatility Premium ETF were among the best-performing ETFs in April 2024.