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Master Bond EP4G-80Med is a one part epoxy designed for use in the assembly of medical devices. This system is formulated with a non-metallic, graphite filler, which leads to good thermal and electrical conductivity. It possesses a thermal conductivity of 1.44-1.73 W/(m•K) and a volume resistivity of 50-100 ohm-cm.
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Master Bond EP21AC is a two part epoxy with a non-halogenated filler that is formulated for applications where arc resistance and flame retardancy are required.