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Semiconductor packaging: A new front in US-China contest for tech supremacy | Jane Lanhee Lee, Ian King, Mackenzie Hawkins & Jillian Deutsch - Vimarsana News

Semiconductor packaging: A new front in US-China contest for tech supremacy | Jane Lanhee Lee, Ian King, Mackenzie Hawkins & Jillian Deutsch

President Joe Biden has adopted a two-pronged approach to constrain China’s high-tech progress, curbing Beijing’s access to leading edge chips while bolstering semiconductor production in the US. He’s about to ratchet up the pressure further, shifting focus to an emerging arena of the contest for technological supremacy: the process of…

A new front is opening up in the US-China conflict over chips - Vimarsana News

A new front is opening up in the US-China conflict over chips

Bringing Taiwan to the World and the World to Taiwan

A new front is opening up in the US-China conflict over chips - Vimarsana News

A new front is opening up in the US-China conflict over chips

One reason for the sudden focus on that special sauce is its necessity to the kind of high-power semiconductors needed for artificial intelligence applications.

Semiconductor Manufacturing: A new front is opening up in the US-China conflict over chips, ET Telecom - Vimarsana News

Semiconductor Manufacturing: A new front is opening up in the US-China conflict over chips, ET Telecom

Semiconductor Manufacturing: Assembly, testing and packaging – usually considered together as “back-end” manufacturing - was always the least glamorous end of the semiconductor industry, with less innovation and lower added value than the “front end” business of making chips with features measured in the billionths of a meter.

TSMC to build US$11 billion chip manufacturing plant in Germany - Vimarsana News

TSMC to build US$11 billion chip manufacturing plant in Germany

In a huge boon for European Union efforts to build a cutting-edge microchip supply chain, the Taiwan Semiconductor Manufacturing Company announced plans on Tuesday for a €10 billion (US$11 billion) plant in Germany. The facility, to be built in Dresden in the country's east, will begin producing chips for the automotive sector by the end of 2027, the company said. The project marks the first foray onto European turf for TSMC, the world's leading maker of advanced chips. The firm will work in con

Source: yahoo.com