J<span class="a-superscript">2</span> and HKSTP to establish first silicon carbide fab in Hong Kong
Center in Science Park to conduct R&D and production of SiC chips
Source: semiconductor-today.com
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IT News Online - HKSTP and J2 Semiconductor Sign MoU to Promote the Development of Microelectronics Industry in Hong Kong J2 Semiconductor Plans to Establish R&D Center and First SiC Wafer Fab in Hong Kong
HKSTP and J2 Semiconductor Sign MoU to Promote the Development of Microelectronics Industry in Hong Kong J2 Semiconductor Plans to Establish R&D Center and First SiC Wafer Fab in Hong Kong
Source: itnewsonline.com
Hong Kong's Thriving OBM Sector Flourishes with Government Support and Robust Ecosystems
Hong Kong's vibrant ecosystem for original brand manufacturing (OBM) attracts global designers, inventors, and researchers, bolstered by strong government support and top-notch marketing expertise.
Source: scmp.com
US-EU semiconductors collaboration milestone as Purdue-imec announce partnership
WEST LAFAYETTE, Ind. – Purdue University and the state of Indiana continue to make giant leaps in semiconductor research growth with a first-of-its-kind agreement with a cutting-edge European nano- and digital technology innovation hub. Interversity Microelectronics Centre (imec) joined Purdue University President Mung Chiang, Indiana Gov. Eric Holcomb, U.S. Sen. Todd Young and Indiana Secretary…
Source: eejournal.com
US-EU semiconductors collaboration milestone as Purdue-imec announce partnership
Purdue University and the state of Indiana continue to make giant leaps in semiconductor research growth with a first-of-its-kind agreement with a cutting-edge European nano- and digital technology innovation hub.
Source: purdue.edu