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05/24/2021 | Press release | Distributed by Public on 05/24/2021 00:14 GUC Announces GLink-3D Die-on-Die Interface IP using TSMC N5 and N6 Process for 3DFabric™ Advanced Packaging Technology Hsinchu, Taiwan - May 24, 2021 - Global Unichip Corp. (GUC), the Advanced ASIC Leader, announces GLink-3D die-on-die interface IP using TSMC's N5 and N6 processes and 3DFabric™advanced packaging technology for AI, HPC, and Networking applications. AI/HPC/Networking memory demand is growing quickly and the SRAM to Logic ratio is also increasing. Logic gains higher density and performance when sca...

Marvell Completes Acquisition of Inphi News provided by Share this article Share this article SANTA CLARA, Calif., April 20, 2021 /PRNewswire/ -- Marvell Technology, Inc. (NASDAQ: MRVL), a leader in data infrastructure semiconductor solutions today announced the completion of its acquisition of Inphi Corporation. The combination creates a U.S. semiconductor powerhouse positioned for end-to-end technology leadership in data infrastructure. The combined company, Marvell Technology, Inc. ("Marvell"), is a Delaware corporation domiciled in the United States. "I am excited to welcome the Inphi t...