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Research breakthrough could enable future 6G comms networks

Research breakthrough could enable future 6G comms networks
it-online.co.za - get the latest breaking news, showbiz & celebrity photos, sport news & rumours, viral videos and top stories from it-online.co.za Daily Mail and Mail on Sunday newspapers.

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Metasurface antenna could enable future 6G communications networks

Metasurface antenna could enable future 6G communications networks
techxplore.com - get the latest breaking news, showbiz & celebrity photos, sport news & rumours, viral videos and top stories from techxplore.com Daily Mail and Mail on Sunday newspapers.

Abdul Jabbar , Qammerh Abbasi , James Watt School Of Engineering , University Of Glasgow , University Of Glasgow Communications , Programmable Dynamic Metasurface Antenna , Next Generation Communication , Imaging Applications , From Concept , Imaging Hub , Masood Ur Rehman , James Watt School ,

BIF Proposes Key Initiatives for Union Budget 2024-25 to Boost Digital Infrastructure

BIF Proposes Key Initiatives for Union Budget 2024-25 to Boost Digital Infrastructure
pc-tablet.co.in - get the latest breaking news, showbiz & celebrity photos, sport news & rumours, viral videos and top stories from pc-tablet.co.in Daily Mail and Mail on Sunday newspapers.

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Circuits Assembly Online Magazine - Advanced Packaging: The Hot Topic in the Florida Sun

More than 50 presentations on hybrid bonding filled rooms to capacity at the IEEE Electronics Components and Technology Conference (ECTC) in Orlando, as did the Tuesday morning panel session. ....

United States , Jan Vardaman , Michaelj Manfra , Robert Bosch , E Jan Vardaman , Toray Industries , University Of Southern California , National Advanced Packaging Manufacturing Program , Technology Adoption , Technology Conference , Metawave Corporation , Mge Foundation , Machine Learning In Package Co , Western Digital , Penn State University , University Of Toronto , Ge Research , National Semiconductor Technology Center , Lower Energy , Electronics Components , Marvell Technology , Submicron Technology , Techsearch International , University Of Texas , Hybrid Bond Interconnections , Chip To Wafer Applications ,

Marqueesemi Semiconductor signs MoU with IIT Bhubaneswar

Bhubaneswar: A Memorandum of Understanding (MoU) was signed between Marqueesemi India Pvt. Ltd. and Indian Institute of Technology, Bhubaneswar on 2nd May 2023 at the School of the Electrical Sciences, IIT Bhubaneswar.The MoU enables establishment of ....

Dinakar Pasla , Mukesh Sukala , Umesh Mohanty , Shreepad Karmalkar , Vijay Shankar , Pradeep Chimalapati , Communications Meit , Head Of The School Electrical Sciences , Business Development Of Marqueesemi , Indian Institute Of Technology , School Of Electrical Sciences , Head Of The School , School Of The Electrical Sciences , Centre For Excellence , Marqueesemi India , Indian Institute , Electrical Sciences , Chair Professor , Prof Shreepad Karmalkar , Smart Grid , Next Generation Communication , High Performance Computing , India Operations , Associate Head , Business Development ,