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Circuits Assembly Online Magazine - Advanced Packaging: The Hot Topic in the Florida Sun - Vimarsana News

Circuits Assembly Online Magazine - Advanced Packaging: The Hot Topic in the Florida Sun

More than 50 presentations on hybrid bonding filled rooms to capacity at the IEEE Electronics Components and Technology Conference (ECTC) in Orlando, as did the Tuesday morning panel session.

The Semiconductor Company from Another World: The Siliconix Story, Part 4 – Siliconix and Stewart-Warner Microcircuits - Vimarsana News

The Semiconductor Company from Another World: The Siliconix Story, Part 4 – Siliconix and Stewart-Warner Microcircuits

In their 15 years of working together since their marriage in 1947, Frances and Bill Hugle accumulated all the technical know-how they needed to manufacture transistors and ICs. From their efforts to produce gemstones at Stuart Labs, they developed techniques for growing crystal ingots, annealing those ingots, and doping them with impurities. From their years…

The Semiconductor Company from Another World: The Siliconix Story, Part 3 – Molecular Electronics - Vimarsana News

The Semiconductor Company from Another World: The Siliconix Story, Part 3 – Molecular Electronics

After spending five years at the DH Baldwin Piano company developing photocells for optical encoders, Bill and Frances Hugle were ready for a new challenge. According to family records, Bill left for Youngwood, Pennsylvania outside of Pittsburgh in 1958 to help Westinghouse set up a new cleanroom at its semiconductor fab in that town. Frances…

The Semiconductor Company from Another World: The Siliconix Story, Part 2 – Starting the Optical Encoder Industry - Vimarsana News

The Semiconductor Company from Another World: The Siliconix Story, Part 2 – Starting the Optical Encoder Industry

Bill Hugle and Frances Sarnat married in 1947 after each had earned an undergraduate degree in chemistry at the University of Chicago. The two started a business making artificial gemstones in 1948, but the venture went bust by 1951 because of a patent infringement lawsuit brought against Bill Hugle by Linde Air Products, which had…

Global Semiconductor Packaging Materials Market to Reach US $29.8 billion by 2027, reports SEMI · EMSNow - Vimarsana News

Global Semiconductor Packaging Materials Market to Reach US $29.8 billion by 2027, reports SEMI · EMSNow

MILPITAS, Calif. – Powered by strong demand for new electronics innovations, the global semiconductor packaging materials market is expected to reach US$29.8

Source: emsnow.com