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PM Modi Breaks Ground On Three Semiconductor Projects — Here Is The Lowdown - Vimarsana News

PM Modi Breaks Ground On Three Semiconductor Projects — Here Is The Lowdown

Prime Minister Narendra Modi, today (13 March), laid the foundation stone of maiden fabrication facility at Dholera and two assembly units at Sanand and Morigaon

Strategic move for HCL Group to venture into chip testing and packaging: Roshni Nadar on Foxconn JV - Vimarsana News

Strategic move for HCL Group to venture into chip testing and packaging: Roshni Nadar on Foxconn JV

Nadar Malhotra stated that HCL Group sees Foxconn as a great strategic partner. “A lot a lot of people know them much more for their manufacturing prowess, but a big part of the universe of their manufacturing is the work that they do (is) in semiconductor design.”