PM Modi Breaks Ground On Three Semiconductor Projects ȁ

Prime Minister Narendra Modi, today (13 March), laid the foundation stone of maiden fabrication facility at Dholera and two assembly units at Sanand and Morigaon

Related Keywords

Taiwan , China , Sanand , Gujarat , India , Japan , New Delhi , Delhi , Singapore , Dholera , India General , Israel , Vietnam , Republic Of , Thailand , Malaysia , South Korea , California , United States , Taiwanese , Narendra Modi , Frank Huang , Tata Electronics , Semiconductor Assembly , Israel Tower Semiconductor , Ibm , Renesas Electronics Corporation Of Japan , Semiconductor Mission , Powerchip Semiconductor Manufacturing Corp , Prime Minister Narendra Modi , Outsourced Semiconductor Assembly , Original Equipment Manufacturers , Renesas Electronics Corporation , Stars Microelectronics , Tower Semiconductor , Pm Modi , Psmc , Dholera Fab Plant , Osat Unit ,