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Semiconductor packaging: A new front in US-China contest for tech supremacy | Jane Lanhee Lee, Ian King, Mackenzie Hawkins & Jillian Deutsch

Published: November 25, 2023

President Joe Biden has adopted a two-pronged approach to constrain China’s high-tech progress, curbing Beijing’s access to leading edge chips while bolstering semiconductor production in the US. He’s about to ratchet up the pressure further, shifting focus to an emerging arena of the contest for technological supremacy: the process of…

Source: businessmirror.com.ph

A new front is opening up in the US-China conflict over chips

Published: November 21, 2023

One reason for the sudden focus on that special sauce is its necessity to the kind of high-power semiconductors needed for artificial intelligence applications.

Source: indiatimes.com

Semiconductor Manufacturing: A new front is opening up in the US-China conflict over chips, ET Telecom

Published: November 21, 2023

Semiconductor Manufacturing: Assembly, testing and packaging – usually considered together as “back-end” manufacturing - was always the least glamorous end of the semiconductor industry, with less innovation and lower added value than the “front end” business of making chips with features measured in the billionths of a meter.

Source: indiatimes.com