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High-Speed PCIe and SSD Development and Challenges

PCIe stands for Peripheral Component Interconnect Express (PCIe), which is a very important specification in computer buses. It is widely used in a large number of applications for data exchange communication within computer components, such as network cards, graphics cards, and nowadays NVMe solid state drives, which are mostly connected to the motherboard via PCIe. Since its introduction in 2003, PCIe has evolved into a fifth or even sixth-generation specification. ....

Physical Layer , Peripheral Component Interconnect Express , Transaction Layer , Data Link Layer , Physical Coding Sublayer , Physical Medium Attachment , Physical Layer System , Feed Forward Equalization , Linear Equalizer , Decision Feedback Equalizer , Equator Application , High Speed ,

M31 on the Specification and Development of MIPI Physical Layer

MIPI is the abbreviation of "Mobile Industry Processor Interface". This article will introduce the physical layer specifications of MIPI architecture, and explain the features and benefits of D-PHY and C-PHY respectively. Then, the MIPI perspective on the development and challenges of automotive electronics and the professional MIPI technical services that M31 can provide will be shared. ....

United States , Automotive Electronics Development , Industry Processor , Physical Layer , Texas Instruments , Application Layer , Protocol Layer , Physical Coding Sub , Physical Medium Attachment , High Speed , Low Power , Alternate Low Power , Module System , Wire States Transitions , Wire States , State Transition Diagram , Control Mode Lane Turnaround , Fast Lane , Electromagnetic Interference ,

Moschip Technologies unveils Multi-Protocol long range 8G SerDes PHY in 28nm

Moschip Technologies unveils Multi-Protocol long range 8G SerDes PHY in 28nm
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Albert Vareljian , Venkata Simhadri , Moschip Technologies , Moschip Technologies Ltd , Time Zone , Chip Technologies Limited , Long Range , Physical Medium Attachment , Chief Architect ,