Stay updated with breaking news from Semiconductor Assembly. Get real-time updates on events, politics, business, and more. Visit us for reliable news and exclusive interviews.
OSAT facilities offer third-party packaging and test services, along with packaging silicon devices that are manufactured by foundries and provide testing devices before shipping to the market.
Dublin, Jan. 26, 2024 (GLOBE NEWSWIRE) -- The
The HCL-Foxconn joint venture is in “advanced-level talks” with Tamil Nadu and Telangana to set up its recently announced semiconductor assembly and testing unit, people in the know of the development told ET. Though Karnataka was also in the running, these people said the JV is likely to prefer Tamil Nadu or Telangana for setting up the unit, “attracted by better incentive structures” offered by them.
Some industry executives, however, said Tamil Nadu could end up bagging the project as Foxconn has “ample presence” in the state. Foxconn makes iPhones for Apple at its facility in Sriperumbudur near Chennai.
India Business News: Foxconn teams up with HCL Group to start a chip packaging and testing venture in India. Foxconn will invest $37.2 million for a 40% ownership in the j