Henkel highlights portfolio of enabling materials
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Source: siliconsemiconductor.net
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Circuits Assembly Online Magazine - Henkel Highlights Portfolio of Enabling Materials for Next-Gen Semiconductor Devices at SEMICON Taiwan 2023
At this week’s SEMICON Taiwan, Henkel brings its extensive range of semiconductor packaging material solutions to customers in a collaborative setting designed to foster discussions that will help address application challenges.
Source: circuitsassembly.com
SEMI: global semiconductor packaging materials market to reach US$29.8b by 2027
Semiconductor Equipment and Materials International (SEMI), TECHCET, and TechSearch International jointly published "Global Semiconductor Packaging Materials Outlook" report on May 24, predicting that the size of global semiconductor packaging and assembly materials will increase from US$26.1 billion in 2022 to US$29.8 billion in 2027, at a compound average growth rate of 2.7%.
Source: digitimes.com
Henkel : debuts ultra-high thermal conductivity pressure-less sintering die attach adhesive that meets automotive grade reliability standards
May 3, 2023Irvine, CA / US 165 W/m-K material well-suited for high-reliability power discrete packages used in automotive and industrial applications Henkel... | May 3, 2023
Source: marketscreener.com
Semiconductor Packaging Materials Market Research Report by Type, Packaging Technology, Region - Global Forecast to 2027
/PRNewswire/ -- Semiconductor Packaging Materials Market Research Report by Type, Packaging Technology, Region - Global Forecast to 2027 - Cumulative Impact of...
Source: prnewswire.com