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Indium Corporation Experts to Present at IMAPS 2022

Three Indium Corporation experts will share their industry knowledge and expertise during four presentations at the 55th International Symposium on Microelectronics (IMAPS) from Oct. 3-6 in Boston, Mass., U.S. ....

United States , Hongwen Zhang , Kevan Griffith , Indium Corporation Guangyu Fan , Chinese Academy Of Science , Thayer School Of Engineering At Dartmouth College , International Symposium On Microelectronics , Central South University Of China , Fine Solder Paste Printing In Sip Assembly , Michigan Technological University , Indium Corporation , Institute Of Metal Research , Three Indium Corporation , International Symposium , Lead Free Lower Temperature Solder Paste , Wafer Level Package Application , Drop In High Temperature Lead Free Solder Paste , Outperforms High Pb Pastes , Power Discrete Applications , Optimal Process Parameters , Ultra Fine Solder Paste Printing , Sip Assembly , Guangyu Fan , Thermal Performance , Liquid Metal Paste Containing Low Content , Metal Particles ,

Indium Corporation Experts to Present at IMAPS 2022

Indium Corporation Experts to Present at IMAPS 2022
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United States , Ronaldc Lasky , Defectsby Christopher Nash , Hongwen Zhang , Kevan Griffith , Indium Corporation Guangyu Fan , Chinese Academy Of Science , International Symposium On Microelectronics , Thayer School Of Engineering At Dartmouth College , Central South University Of China , Fine Solder Paste Printing In Sip Assembly , Michigan Technological University , Indium Corporation , Institute Of Metal Research , International Symposium , Lead Free Lower Temperature Solder Paste , Wafer Level Package Application , Drop In High Temperature Lead Free Solder Paste , Outperforms High Pb Pastes , Power Discrete Applications , Optimal Process Parameters , Ultra Fine Solder Paste Printing , Sip Assembly , Guangyu Fan , Thermal Performance , Liquid Metal Paste Containing Low Content ,