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Circuits Assembly Online Magazine - Indium Corporation's Sze Pei Lim to Present at ICEP Japan - Vimarsana News

Circuits Assembly Online Magazine - Indium Corporation's Sze Pei Lim to Present at ICEP Japan

Published: March 30, 2023

Indium Corporation’s Senior Global Product Manager for Semiconductor and Advanced Materials Sze Pei Lim is set to deliver a presentation at ICEP 2023 in Kumamoto, Japan, on April 19. The presentation will cover the findings from a technical paper, co-authored by R&D Manager for the Alloy Group HongWen Zhang, titled An In-Containing Lower-Temperature Lead-Free Solder Paste for Wafer-Level Package Application that Outperforms SAC305.

Source: circuitsassembly.com
Related Topics:
National University Of SingaporeSingapore GeneralSouth KoreaUnited KingdomMike BuetowIndium CorporationInstitute Of ElectricalPackaging Society Malaysia ChapterNemi Packaging Technology Integration GroupInternational Electronics Manufacturing InitiativeAlloy Group Hongwen ZhangIndium Corporation Senior Global ProductElectronics EngineersInternational Electronics Manufacturing TechnologySenior Global Product ManagerAdvanced Materials Sze Pei LimWafer Level Package ApplicationAdvanced MaterialsPackaging Technology Integration GroupPackaging Society MalaysiaNational UniversitySix Sigma Green BeltSze Pei LimCep Japan
Indium Corporation's Sze Pei Lim to Present at ICEP Japan · EMSNow - Vimarsana News

Indium Corporation's Sze Pei Lim to Present at ICEP Japan · EMSNow

Published: March 30, 2023

Indium Corporation’s Senior Global Product Manager for Semiconductor and Advanced Materials Sze Pei Lim is set to deliver a presentation at ICEP 2023 in

Source: emsnow.com
Related Topics:
United KingdomSouth KoreaNational University Of SingaporeSingapore GeneralHongwen ZhangNemi Packaging Technology Integration GroupPackaging Society Malaysia ChapterElectronics EngineersMalloy GroupInternational Electronics Manufacturing InitiativeInstitute Of ElectricalManufacturing TechnologyIndium CorporationIndium Corporation Senior Global ProductSenior Global Product ManagerAdvanced MaterialsSze Pei LimWafer Level Package ApplicationPackaging Technology Integration GroupPackaging Society MalaysiaNational UniversitySix Sigma Green Belt
Indium Corporation Experts to Present at IMAPS 2022 - Vimarsana News

Indium Corporation Experts to Present at IMAPS 2022

Published: September 1, 2022

Three Indium Corporation experts will share their industry knowledge and expertise during four presentations at the 55th International Symposium on Microelectronics (IMAPS) from Oct. 3-6 in Boston, Mass., U.S.

Source: azom.com
Related Topics:
United StatesHongwen ZhangKevan GriffithIndium Corporation Guangyu FanChinese Academy Of ScienceThayer School Of Engineering At Dartmouth CollegeInternational Symposium On MicroelectronicsCentral South University Of ChinaFine Solder Paste Printing In Sip AssemblyMichigan Technological UniversityIndium CorporationInstitute Of Metal ResearchThree Indium CorporationInternational SymposiumLead Free Lower Temperature Solder PasteWafer Level Package ApplicationDrop In High Temperature Lead Free Solder PasteOutperforms High Pb PastesPower Discrete ApplicationsOptimal Process ParametersUltra Fine Solder Paste PrintingSip AssemblyGuangyu FanThermal PerformanceLiquid Metal Paste Containing Low Content