Latest Breaking News On - Packaging society malaysia chapter - Page 1 : vimarsana.com

Indium Corporation’s Senior Global Product Manager for Semiconductor and Advanced Materials Sze Pei Lim is set to deliver a presentation at ICEP 2023 in Kumamoto, Japan, on April 19. The presentation will cover the findings from a technical paper, co-authored by R&D Manager for the Alloy Group HongWen Zhang, titled An In-Containing Lower-Temperature Lead-Free Solder Paste for Wafer-Level Package Application that Outperforms SAC305.

National university of singaporeSingapore generalSouth koreaUnited kingdomMike buetowIndium corporationInstitute of electricalPackaging society malaysia chapterNemi packaging technology integration groupInternational electronics manufacturing initiativeAlloy group hongwen zhangIndium corporation senior global productElectronics engineersInternational electronics manufacturing technologySenior global product managerAdvanced materials sze pei lim