Circuits Assembly Online Magazine - Surfx Technologies to Showcase Flux-Free Flip Chip and Hybrid Wafer Bonding Innovations at productronica 2023
Surfx Technologies, LLC, to announce its participation in productronica 2023, one of the industry’s premier trade shows for electronics manufacturing and assembly. The company will be focusing on its revolutionary flux-free flip chip and hybrid wafer bonding technologies, showcasing its commitment to advancing semiconductor manufacturing processes. The event is scheduled to take place Nov. 14-17 at the Messe München in Munich, Germany.
Source: circuitsassembly.com
