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Aledia produces its first nanowire chips on 300mm silicon wafers 16 Dec 2020 After several years in stealth mode, French developer of microLED displays is now using CEA-Leti pilot lines. The company, which has been developing its technology on 200mm (8in) silicon wafers over the past eight years, will produce the chips on both 200mm and 300mm wafers. Aledia says that the larger wafers provide better economic payoff and cost-effective integration with smaller-node electronics, which are only available on 300mm silicon wafers. In 2012, the company was spun out of French research institute CEA-Leti, which develops micro- and nanotechnologies. The work on 300mm wafers has been performed by joint Aledia and CEA-Leti teams. ....
Our NanoNews Digest Sponsors Home > Press > Aledia, French Developer of Next-Generation MicroLED Displays For High-Volume Consumer Markets, Announces it Has Produced its First Nanowire Chips on 300mm Silicon Wafers Using CEA-Leti Pilot Lines: Company will produce microLEDs on both 200mm and 300mm silicon wafers Abstract: Aledia, a French startup pioneering a disruptive technology for microLED displays, today announced it has manufactured the worlds first microLED chips produced on 300mm (12) silicon wafers. The company, which developed its breakthrough technology on 200mm (8) silicon wafers over the past eight years, will produce the chips on both 200mm and 300mm wafers. The larger wafers provide better economic payoff and cost-effective integration with smaller-node electronics, which are only available on 300mm silicon wafers. Aledia was spun out of CEA-Leti, a French research institute pioneering micro- and nanotechnologies, in 2012, and the work on 300mm waf ....
Aledia produces first micro-LED chips on 300mm silicon wafers Aledia S.A of Echirolles, near Grenoble, France (a developer and manufacturer of 3D micro-LEDs for display applications based on its gallium nitride nanowires-on-silicon platform) has manufactured what is says are the first micro-LED chips produced on 300mm (12”) silicon wafers. The firm, which developed its technology on 200mm (8”) silicon wafers over the past eight years, will produce the chips on both 200mm and 300mm wafers. The larger wafers provide better economic payoff and cost-effective integration with smaller-node electronics, which are only available on 300mm silicon wafers. Aledia was spun out of Grenoble-based micro/nanotechnology R&D center CEA-Leti in 2012, and the work on 300mm wafers has been performed by joint Aledia and CEA-Leti teams. ....