Canon Commences Sales of the FPA-5520iV LF Option for Back-End Process Semiconductor Lithography Systems

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MELVILLE, N.Y., April 8, 2021 /PRNewswire/ -- Canon U.S.A., Inc., a leader in digital imaging solutions, today announced that its parent company, Canon Inc., has launched the FPA-5520iV LF Option for back-end process semiconductor lithography systems. This device features an i-line stepper
1 with a 1.5 micrometer
2 resolution and a wide exposure field of 52 mm x 68 mm for advanced packaging
3.
Canon Commences Sales of the FPA-5520iV LF Option for Back-End Process Semiconductor Lithography Systems
In the field of semiconductor chip performance enhancement, alongside the miniaturization of circuits in front-end process of semiconductor manufacturing, higher-density packaging in back-end processes has become a valuable resource within this market. Advanced packaging with high performance requires fine redistribution layer patterns

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