Mobiveil and Winbond Partner to Deliver HYPERRAM IP Controller to SoC Designers

Mobiveil HYPERRAM Controller Leverages Winbond’s HYPERBUS-based HYPERRAM x8/x16 with 250 MHz Memory Device Targets Automotive, Smart IoT, Industrial, Wearables, TWS, Wireless headsets, Smart Speakers, Connectivity Applications  MILIPITAS, CALIF. –– August 2, 2023 –– Mobiveil, Inc., a fast-growing supplier of silicon intellectual property (SIP), platforms and IP-enabled design services, today announced a partnership with Winbond to…

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