Although TSMC s 3nm process has already achieved mass production, its capacity utilization rate is not yet filled. Chen Liang-chia, a distinguished professor of the mechanical engineering department at National Taiwan University (NTU), stated that more advanced processes have extremely high production costs, and yield rates are also an issue. To address these issues, Chen mentioned a better through-silicon via (TSV) technology developed by his team that could be one of the solutions.
Leading Taiwan-based OSATs including Powertech Technology (PTI) and ASE Group are reducing prices amid ongoing cost pressures, according to industry sources.
Although automotive chips are relatively stable in the semiconductor supply chain, the uncertainty of the overall economic environment has already impacted the purchasing power of the automobile market. Taiwan-based power component foundries and OSATs (outsourced semiconductor assembly and test) all pointed out that mid- to low-tier chip prices have already begun to face pressure.
Taiwan-based OSATs such as ChipMOS Technologies and Chipbond Technology are seeing the monthly operating growth rate of chip and backend companies exceed 20%.