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SK Hynix confirms $3 87 billion investment in Indiana advanced chip packaging facility

SK Hynix confirms $3 87 billion investment in Indiana advanced chip packaging facility
datacenterdynamics.com - get the latest breaking news, showbiz & celebrity photos, sport news & rumours, viral videos and top stories from datacenterdynamics.com Daily Mail and Mail on Sunday newspapers.

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Multi-billion-dollar investment will make Indiana leader in semiconductor packaging

WEST LAFAYETTE, Ind. - Governor Eric J. Holcomb, Secretary of Commerce David Rosenberg, and Purdue University President Mung Chiang joined executives .

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South Korean chip maker to build $3 87 billion manufacturing plant in Indiana

Semiconductor factory will help the U.S. to “onshore more of its critical chip supply chain.”

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Gov Holcomb, IEDC announce generational multi-billion-dollar investment to make Indiana leader in semiconductor packaging

Gov Holcomb, IEDC announce generational multi-billion-dollar investment to make Indiana leader in semiconductor packaging
streetinsider.com - get the latest breaking news, showbiz & celebrity photos, sport news & rumours, viral videos and top stories from streetinsider.com Daily Mail and Mail on Sunday newspapers.

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Gov Holcomb, IEDC announce generational

Gov Holcomb, IEDC announce generational
globenewswire.com - get the latest breaking news, showbiz & celebrity photos, sport news & rumours, viral videos and top stories from globenewswire.com Daily Mail and Mail on Sunday newspapers.

United statesWest lafayettePurdue universitySouth koreaRepublic of koreaMung chiangErin easterKwak noh jungStates hyundong choTodd youngDavid rosenbergEricj holcombKorea exchangeInnovation development districtPurdue research parkIndiana economic development corporation