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SK hynix Signs Investment Agreement of Advanced Chip Packaging with Indiana

SK hynix Signs Investment Agreement of Advanced Chip Packaging with Indiana
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SK hynix announces semiconductor advanced packaging investment in Purdue Research Park

SK hynix announces semiconductor advanced packaging investment in Purdue Research Park
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Purdue Research Foundation: SK hynix announces semiconductor advanced packaging investment in Purdue Research Park

Purdue Research Foundation: SK hynix announces semiconductor advanced packaging investment in Purdue Research Park
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SK hynix announces semiconductor advanced packaging

The company s facility for AI memory chips marks the largest single economic development in the history of the state.

United statesWest lafayettePurdue universitySouth koreaErin easterSue ellspermannTodd youngGregory deasonKwak noh jungArati prabhakarBrian edelmanMitch danielsMitchelle daniels jrMichael berghoffMung chiangTim doty

SK hynix to Invest $3 9B in Indiana HBM Fab and R&D with Purdue - High-Performance Computing News Analysis

Memory chip company SK hynix announced it will invest $3.87 billion in West Lafayette, Indiana to build an advanced packaging fabrication and R&D [.]

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