Page 2 - Integrity Solution News Today

Cadence today announced it has continued to expand its collaboration with Arm to advance mobile device silicon success, providing customers with a faster path to tapeout through use of Cadence® digital and verification tools and the new Arm® Total Compute Solutions 2023 (TCS23), which includes the Arm Cortex®-X4, Arm Cortex-A720 and Cortex-A520 CPUs and Immortalis™-G720, Mali™-G720 and Mali-G620 GPUs.

United Microelectronics, a global semiconductor foundry, and Cadence Design Systems, have announced that the Cadence 3D-IC reference flow, featuring the Integrity 3D-IC Platform, has been certified for UMC’s chip stacking technologies.

HSINCHU, Taiwan & SAN JOSE, Calif., February 2, 2023—United Microelectronics Corporation (NYSE: UMC; TWSE: 2303) (“UMC”), a leading global semiconductor foundry, and Cadence Design Systems, Inc. (Nasdaq: CDNS) today announced that the Cadence® 3D-IC reference flow, featuring the Integrity™ 3D-IC Platform, has been certified for UMC’s chip stacking technologies, enabling faster time to market. UMC’s…

United Microelectronics Corporation , a leading global semiconductor foundry, and Cadence Design Systems, Inc. today announced that the Cadence® 3D-IC reference flow, featuring the... | February 1, 2023

Cadence Design Systems has announced that TSMC has certified its digital and custom/analogue design flows for the latest TSMC N4P and N3E processes in support of the new Design Rule Manual (DRM) and FINFLEX technology.

Cadence Design Systems has introduced the Voltus-XFi Custom Power Integrity Solution, a custom electromigration and IR drop (EM-IR) solution that enables the development of efficient, low-power ICs.

SAN JOSE, Calif., July 07, 2022—Cadence Design Systems, Inc. (Nasdaq: CDNS) today announced the new Cadence® Voltus™-XFi Custom Power Integrity Solution, a custom electromigration and IR drop (EM-IR) solution that delivers improved ease of use with minimal tuning and enables the development of efficient, low-power ICs. Using the new Voltus-XFi solution, which is seamlessly integrated…

Highlights: • Certification enables customers to advance the design of aerospace, hyperscale computing, AI, mobile and consumer applications using Cadence and GF® technologies • Cadence digital full flow optimized for the GF 12LP/LP+ process platforms enables mutual customers to reach PPA goals faster and deliver new products to market with shorter design cycles SAN JOSE,…

SAN JOSE, Calif., Oct. 27, 2021 -- Highlights: The Cadence 3D-IC solution centers on the Integrity 3D-IC platform, which provides integrated planning,

Highlights: ● The Cadence 3D-IC solution centers on the Integrity 3D-IC platform, which provides integrated planning, implementation and system analysis to optimize PPA for multi-chiplet systems ● The Tempus Timing Signoff Solution with inter-die analysis and STA technologies results in faster time to tapeout ● The Voltus IC Power Integrity Solution, tightly coupled with the…