Page 61 - Smc News Today

The revised strategy aims to bolster efforts to develop and produce cutting-edge semiconductors critical for economic security measures and advanced technology like generative AI.

TSMC held its shareholders meeting today, where chairman Mark Liu stated that the company has faced various global challenges in recent years, including the US-China trade war, climate change, the pandemic, and the Russia-Ukraine war. However, Liu noted that TSMC continues to develop rapidly on a stable path, and the outlook is "very promising."

The semiconductor chip sits at the centre of a technology war being waged between the US and China.

Japan's government hopes that the chipmaker will continue to expand its investment within the country.

"We are at the beginning of a new computing era: accelerated computing and generative AI," said Nvidia CEO Jensen Huang in a press Q&A at Computex 2023. Huang discussed Nvidias efforts to expand and scale generative AI by introducing Grace Hopper, a game-changing new processor.

TSMC is contemplating a 3 to 6 percent price increase for its advanced process manufacturing beginning in January 2024, according to sources at IC design houses. The price increases vary based on the production method, order quantity, and degree of collaboration.

The changes are informed by the service’s Infantry Battalion Experiment, part of Force Design 2030.

Taiwans semiconductor supply chain has "fine-tuned" production plans for a major artificial intelligence (AI) chip client in order to satisfy demand in time, according to industry sources.

After months of negotiations, Taiwan and the U.S. signed the first agreement under the U.S.-Taiwan Initiative on 21st-Century Trade on June 1 in Washington D.C. It outlines practices and procedures aimed at streamlining and strengthening trade relations. Both sides of negotiators deserve a round of accolades, but the fact that it does not cover tariff reductions or exemptions still puts many stakeholders down.

Keysight Technologies, dedicated to supplying electronics test/measurement equipment and software, has recently become a member of the TSMC Open Innovation Platform (OIP) 3D Fabric Alliance formed to accelerate 3D IC ecosystem innovation and readiness. The membership will allow the US vendor to utilize the TSMC 3Dblox standard to develop electronic design automation (EDA) software and testing solutions.