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Intel aims to put a trillion transistors in a chip package b
Intel aims to put a trillion transistors in a chip package b
Intel aims to put a trillion transistors in a chip package by 2030
As chip packaging gets more advanced, Intel has said it aspires to put a trillion transistors in a package by 2030 with his next-generation chip packaging technology.Intel has led the industry in advanced packaging for a couple of decades.Its ...
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