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SkyWater Technology and Deca Technologies (Deca), a provider of advanced electronic interconnect technology, have announced a new Department of Defense (DOD) effort to expand domestic fan-out wafer level packaging (FOWLP) capabilities for both government and commercial customers.
SkyWater is the first domestic provider of Deca’s M-Series™ fan-out and Adaptive Patterning® technologies to support the reshoring of the semiconductor supply chain ...
WEST LAFAYETTE, Ind. Purdue University, long known for its engineering programs, is leaning hard into its emphasis on creating an international footprint in chip technology and microelectronics workforce innovation.
WEST LAFAYETTE – Purdue University is working toward the future in microelectronic product development with the creation of the Institute for Advanced System Integration and Packaging (ASIP) to enable faster designing and building of microelectronic systems. The new institute, announced Wednesda ...