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Vicor : to present new ways to accelerate automotive electrification and the adoption of 48V at 11th International Conference on Power Electronics 2023

ECCE Asia in Jeju, Korea on May 22 - 25, 2023. The Vicor proven solutions use the highest density power modules and leverage 48V and proprietary power architectures that deliver up to 50% reduction in. | May 19, 2023 ....

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Low-pressure, thin bond line thermal interface material (TIM) from Henkel brings best-in-class thermal management solution for next-gen ICs

Adding to its broad portfolio of thermal interface material (TIM) innovations, Henkel announced the commercial availability of Bergquist Hi Flow THF 5000UT. The phase change film TIM marks a significant milestone in thermal management materials development, allowing for low mechanical pressure to achieve thorough wet out and an ultra-thin bond line at the interface. This is critical for challenging package designs with complex architectures, such as lidless multi-chip devices used in high-. ....

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MyJournals.org - Science - '[ASAP] Photocleavable Ortho-Nitrobenzyl-Protected DNA Architectures and Their Applications' (Chemical Reviews)

MyJournals.org - Science - [ASAP] Photocleavable Ortho-Nitrobenzyl-Protected DNA Architectures and Their Applications (Chemical Reviews) ....

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Rambus Inc. : An expensive master of chip interface technologies

Rambus is a technology licensing company that specializes in designing architectures that enhance the end-user experience of electronic systems. It was founded in 1990 and is headquartered in Los. | April 19, 2023 ....

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Geely Holding Showcases Next-Generation Products at Shanghai International Automobile Industry Exhibition

Geely Holding Showcases Next-Generation Products at Shanghai International Automobile Industry Exhibition
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