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Co-Packaged Optics Market Set for Remarkable Growth, New

$148 Billion Chiplet Market by Processor, Packaging Technology - Global Forecast to 2028

DUBLIN, Feb. 19, 2024 /PRNewswire/ — The “Chiplet Market by Processor (Field-Programmable Gate Array (FPGA), Central Processing Unit (CPU), Graphics Processing Unit (GPU), APU, AI ASIC Co-Processor), Packaging Technology (SiP, FCCSP, FCBGA, 2.5D/3D, WLCSP, Fan-Out) – Global Forecast to 2028″ report has been added to ResearchAndMarkets.com’s offering. The chiplet market is projected to grow from USD 6.5 […]

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