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Google faces internal battle over research on AI to speed chip design - Vimarsana News

Google faces internal battle over research on AI to speed chip design

By Paresh Dave OAKLAND, Calif. (Reuters) - Alphabet Inc's Google said on Monday it had recently fired a senior engineering manager after colleagues, w...

Source: wsau.com
Google faces internal battle over AI silicon design research - Vimarsana News

Google faces internal battle over AI silicon design research

Senior manager sacked amid harassment accusations.

IBM's New Telum Chip Reboots the Mainframe - Vimarsana News

IBM's New Telum Chip Reboots the Mainframe

The mainframe’s diminishing significance today does not mean it’s dwindling away either. IBM has touted their z16 mainframe’s real-time AI processing of transactions for fraud and lauded it as “industry’s first quantum-safe system.” But at the core of all this is Big Blue’s Telum chip.

Source: ieee.org
How can we reduce the carbon footprint of global computing? - Vimarsana News

How can we reduce the carbon footprint of global computing?

The Climate Implications of Computing and Communications workshop at MIT highlighted how new approaches to computing can save energy and help the planet.

Source: mit.edu
Apple's UltraFusion Chip-to-Chip Interconnect uses TSMC's 3DFrabric Technology - Vimarsana News

Apple's UltraFusion Chip-to-Chip Interconnect uses TSMC's 3DFrabric Technology

In June 2021 Patently Apple posted a report titled "TSMC's 3DFabric Technology is the next big wave in Chip Design that Apple will take advantage of in the not-too-distant Future." While TSMCs 3DFabric didn't first debut on an iPhone, a new report states that TSMC has clarified that Apple's UltraFusion Chip-to-Chip interconnect does.