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The scheme has three components – Chip Design infrastructure support, Product Design Linked Incentive and Deployment Linked Incentive.
Under the DLI Scheme, financial incentives and design infrastructure support will be extended to domestic companies, start-ups and MSMEs across various stages of development and deployment of semiconductor design.
Intel has recently been making moves in the Israeli market.
To help make China a self-reliant “technology superpower,” the ruling Communist Party is pushing the world's biggest e-commerce company to take on the tricky, expensive business of designing its own processor chips — a business unlike anything Alibaba has done before.
Researchers have urged EU member countries to invest a lot more in chip design with a view to becoming less dependent on China. But other parts of the value chain also need more attention.