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Fremont, CA (PRWEB) October 07, 2021 -- YES (Yield Engineering Systems, Inc.), a leading manufacturer of process equipment for semiconductor advanced

YES EcoCoat™ HVM to Help Customer Fulfill Large NIH Contract for Rapid COVID Antibody Testing Devices July 26, 2021 FacebookTwitterEmail FREMONT, Calif. (PRWEB) July 26, 2021 YES (Yield Engineering Systems, Inc.), a leading manufacturer of process equipment for semiconductor advanced packaging, life sciences and “More-than-Moore” applications, today announced that one of its customers has been awarded a multimillion-dollar contract by the US’s National Institutes of Health to manufacture a new COVID testing device for mass distribution. The award was made possible through the NIH’s ...

Semiconductor Packaging News - Exclusive: YES and SPEC Sign Strategic Alliance Agreement

YES (Yield Engineering Systems, Inc.) and SPEC (Semiconductor Process Equipment Corp.) Sign Strategic Alliance Agreement Share Article Agreement covers design, manufacture and distribution of semiconductor equipment “We look forward to combining our knowledge base with YES’s large and ever-growing repository of process expertise to address customer needs,” said Kevin McGillivray, co- founder of SPEC. FREMONT, Calif. (PRWEB) June 01, 2021 YES (Yield Engineering Systems, Inc.), a leading manufacturer of process equipment for...

YES Joins Forces with EV Group Competence Center in Austria YES ( Yield Engineering Systems, Inc.), a leading manufacturer of process equipment for semiconductor advanced packaging, life sciences and "More-than-Moore" applications, today announced it is working with EV Group (https://www.evgroup.com/) and will install a YES EcoCoat monolayer coating system at EVG's NILPhotonics Competence Center in Austria. This collaboration will provide complete process flow demos for prospective semiconductor, life science and optical coatings (AR/VR) customers. EV Group is a major supplier of capital equi...