Page 7 - Engineering Systems Inc News Today : Breaking News, Live Updates & Top Stories | Vimarsana

Yield Engineering Systems, Inc. Joins Forces with EV Group Share Article YES EcoCoat™ to be installed at EVG’s NILPhotonics® Competence Center in Austria We believe that this collaboration with EVG will help us to showcase our technologies to companies developing breakthrough products in the semiconductor, life science and AR/VR markets,” said Rezwan Lateef, President of YES. FREMONT, Calif. (PRWEB) April 19, 2021 YES (Yield Engineering Systems, Inc.), a leading manufacturer of process equipment for semiconductor advanced...

Winstek Places Second Order for YES (Yield Engineering Systems, Inc.) VertaCure™ XP Share Article YES today announced that it will deliver another VertaCure™ XP, the latest version of its flagship VertaCure vacuum curing system, to Winstek Semiconductor Co., Ltd. “The VertaCure XP system’s enhanced capabilities make it especially well-suited for the demands of ‘Beyond Moore’ advanced packaging, and its ability to handle both 200 mm and 300 mm wafers is ideal for our WLCSP application,” said Cheng-Che Tsou, Director of Bumping Engineering at Winstek. ...

YES Receives VertaBond™ Purchase Order from a Tier 1 Memory Manufacturer Share Article Yield Engineering Systems, Inc. announces that a leading memory manufacturer has ordered the YES VertaBond™ system for wafer-to-wafer and die-to-wafer bonding, utilized in bringing next-generation HBM (high bandwidth memory) to market. "This new VertaBond system will enable our valued customer’s most advanced HBM development and pilot production,” said Alex Chow, Asia Sales President & General Manager at YES. FREMONT, Calif. (PRWEB) Mar...

YES Receives Repeat, Volume VertaCure Order from Major Foundry Share Article YES announced today that it has received a repeat, volume purchase order from a leading foundry for its VertaCure polyimide curing system and its next-generation VertaCure XP system. “We are very pleased to support this major advanced packaging expansion, and we look forward to working with this high-profile customer to meet their exciting production and technology roadmap,” said Alex Chow, Asia Sales President & General Manager at YES. FREMONT, Calif. (PRWEB) ...

YES Adds Deca’s Rapid Cure Technology to its Product Line Share Article Unique UV plus direct thermal exposure process brings throughput & performance advantages “We are extremely pleased to join forces with Deca, an acknowledged leader in the Advanced Packaging field, to enhance our thermal processing portfolio,” said Rezwan Lateef, President of YES. FREMONT, Calif. (PRWEB) January 25, 2021 YES (Yield Engineering Systems, Inc.), a leading manufacturer of process equipment for semiconductor advanced packaging, life science...