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December 17, 2020 Samsung Foundry Certifies Cadence System Analysis and Advanced Packaging Design Tool Flow for 2.5/3D Chip Designs Proven flow featuring the Celsius Thermal Solver and Clarity 3D Solver accelerates 2.5/3D designs for hyperscale, communications and automotive applications SAN JOSE, Calif., December 16, 2020—Cadence Design Systems, Inc. (Nasdaq: CDNS) today announced that Samsung Foundry has certified the complete Cadence® system analysis and advanced packaging design tool flow as a Samsung Multi-Die Integration (MDI™) advanced packaging reference flow. This proven on-/off...

Samsung Foundry Certifies Cadence System Analysis and Advanced Packaging Design Tool Flow for 2.5/3D Chip Designs Proven flow featuring the Celsius Thermal Solver and Clarity 3D Solver accelerates 2.5/3D designs for hyperscale, communications and automotive applications SAN JOSE, Calif.–(BUSINESS WIRE)–Cadence Design Systems, Inc. (Nasdaq: CDNS) today announced that Samsung Foundry has certified the complete Cadence ® system analysis and advanced packaging design tool flow as a Samsung Multi-Die Integration (MDI ™) advanced packaging reference flow. This proven on-/off-chip design flo...

Undang-Undang Perlindungan Data Pribadi (UU PDP), yang saat ini masih berupa rancangan undang-undang, ditargetkan bisa selesai awal tahun depan. "Saya ...