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HSINCHU, Taiwan & SAN JOSE, Calif., February 2, 2023—United Microelectronics Corporation (NYSE: UMC; TWSE: 2303) (“UMC”), a leading global semiconductor foundry, and Cadence Design Systems, Inc. (Nasdaq: CDNS) today announced that the Cadence® 3D-IC reference flow, featuring the Integrity™ 3D-IC Platform, has been certified for UMC’s chip stacking technologies, enabling faster time to market. UMC’s…

United Microelectronics Corporation , a leading global semiconductor foundry, and Cadence Design Systems, Inc. today announced that the Cadence® 3D-IC reference flow, featuring the... | February 1, 2023

Highlights: • Using Innovus Implementation, GUC delivered a 3.16GHz HPC core design with 3.5M instances on the TSMC N3 process technology • GUC realized a 9% area shrink and an 8% reduction in power consumption on a CPU design on the TSMC N5 process using the AI-enabled Cadence Cerebrus SAN JOSE, Calif., January 19, 2023 —Cadence…

Highlights: • Provides customers with a first-of-its-kind fully automated environment featuring a massively parallel and distributed architecture • Supports design optimization and signoff with unlimited capacity, delivering overnight turnaround time while significantly reducing design power • Cloud-ready solution advances emerging design areas, including hyperscale computing, 5G communications, mobile, automotive and networking SAN JOSE, Calif., October…