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New Electronics - Voltus-XFi Custom Power Integrity Solution - Vimarsana News

New Electronics - Voltus-XFi Custom Power Integrity Solution

Cadence Design Systems has introduced the Voltus-XFi Custom Power Integrity Solution, a custom electromigration and IR drop (EM-IR) solution that enables the development of efficient, low-power ICs.

Cadence Introduces the Voltus-XFi Custom Power Integrity Solution, Delivering over 3X Productivity Gains - Vimarsana News

Cadence Introduces the Voltus-XFi Custom Power Integrity Solution, Delivering over 3X Productivity Gains

SAN JOSE, Calif., July 07, 2022—Cadence Design Systems, Inc. (Nasdaq: CDNS) today announced the new Cadence® Voltus™-XFi Custom Power Integrity Solution, a custom electromigration and IR drop (EM-IR) solution that delivers improved ease of use with minimal tuning and enables the development of efficient, low-power ICs. Using the new Voltus-XFi solution, which is seamlessly integrated…

Cadence Digital Full Flow Achieves Certification for GlobalFoundries® 12LP/12LP+ Process Platforms - Vimarsana News

Cadence Digital Full Flow Achieves Certification for GlobalFoundries® 12LP/12LP+ Process Platforms

Highlights: • Certification enables customers to advance the design of aerospace, hyperscale computing, AI, mobile and consumer applications using Cadence and GF® technologies • Cadence digital full flow optimized for the GF 12LP/LP+ process platforms enables mutual customers to reach PPA goals faster and deliver new products to market with shorter design cycles SAN JOSE,…

Cadence Integrity 3D-IC Platform Supports TSMC 3DFabric Technologies - Vimarsana News

Cadence Integrity 3D-IC Platform Supports TSMC 3DFabric Technologies

SAN JOSE, Calif., Oct. 27, 2021 -- Highlights: The Cadence 3D-IC solution centers on the Integrity 3D-IC platform, which provides integrated planning,

Cadence Integrity 3D-IC Platform Supports TSMC 3DFabric™ Technologies for Advanced Multi-Chiplet Designs - Vimarsana News

Cadence Integrity 3D-IC Platform Supports TSMC 3DFabric™ Technologies for Advanced Multi-Chiplet Designs

Highlights: ● The Cadence 3D-IC solution centers on the Integrity 3D-IC platform, which provides integrated planning, implementation and system analysis to optimize PPA for multi-chiplet systems ● The Tempus Timing Signoff Solution with inter-die analysis and STA technologies results in faster time to tapeout ● The Voltus IC Power Integrity Solution, tightly coupled with the…