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Taipei, June 9 (CNA) A move by the government to tighten restrictions in the wake of an outbreak of indigenous COVID-19 infections reduced sales in the local food and beverage industry by more than 60 percent, according to a survey released by restaurant mobile point of sale information advisory firm iChef Wednesday.
The government’s tightened restrictions to control a domestic COVID-19 outbreak have reduced sales in the local food and beverage industry by more than 60 percent, an iChef Co Ltd (資廚管理顧問) survey said yesterday. The restaurant mobile point-of-sale information advisory firm’s survey said that since the level 3 alert went into effect on May 15, average weekly sales generated by the food and beverage industry from May 17 to June 6 were less than 40 percent of the weekly average in April. The survey covered more than 7,000 restaurants and food stalls nationwide to show the effect...
(Bloomberg) -- Bullish calls on Chinese stocks appear to have gotten on the nerves of the country’s regulators, with state media reporting that authorities are against analysts forecasting specific levels for the market.
GUC announces GLink-3D Die-on-Die interface IP Global Unichip (GUC), an ASIC developer, has announced GLink-3D die-on-die interface IP using TSMC's N5 and N6 processes and 3DFabric advanced packaging technology for AI, HPC, and networking applications. With AI, HPC and networking memory demand growing there is a need for SRAM/Logic disintegration allowing the implementation of separate SRAM and Logic at the most efficient process nodes. Layers of CPU and SRAM (Last Level Cache, packet buffers) dies can be assembled over and under interconnect/IO dies using TSMC's 3DF...
05/24/2021 | Press release | Distributed by Public on 05/24/2021 00:14 GUC Announces GLink-3D Die-on-Die Interface IP using TSMC N5 and N6 Process for 3DFabric⢠Advanced Packaging Technology Hsinchu, Taiwan - May 24, 2021 - Global Unichip Corp. (GUC), the Advanced ASIC Leader, announces GLink-3D die-on-die interface IP using TSMC's N5 and N6 processes and 3DFabricâ¢advanced packaging technology for AI, HPC, and Networking applications. AI/HPC/Networking memory demand is growing quickly and the SRAM to Logic ratio is also increasing. Logic gains higher density and performance when sca...