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TSMC details 12.8 Tbps on-package communication solution — an efficient silicon photonics interconnect for AI

TSMC goes optical with a 3D stacked silicon photonics interconnect called COUPE — Compact Universal Photonic Engine. It could deliver up to 12.8 Tbps of on-package connectivity for future chip designs. ....

United States , Kevin Zhang , Northern American Technology Symposium , Business Development , Vice President , Compact Universal Photonic Engine , Octal Small Form Factor Pluggable , Optical Engine ,

SK Hynix Boosting HBM Output with $14.6 Billion Investment

SK Hynix Boosting HBM Output with $14.6 Billion Investment
eetimes.com - get the latest breaking news, showbiz & celebrity photos, sport news & rumours, viral videos and top stories from eetimes.com Daily Mail and Mail on Sunday newspapers.

Ch Ungch Ong Bukto , South Korea , Kyonggi Do , Dylan Patel , Kwak Noh Jung , Kevin Zhang , Taiwan Semiconductor Manufacturing Co , Business Development , North Chungcheong Province , Semianalysis Chief Analyst Dylan Patel , Jim Handy , Objective Analysis , Taiwan Semiconductor Manufacturing ,

TSMC: A16 manufacturing will start in 2026

The race is on to manufacture the worlds fastest chips, and TSMC has just made a bold claim to be winning it. ....

United States , Kevin Zhang , America Technology Symposium ,