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- Introduction of the world's highest performance* vector supercomputer at Tohoku University -TOKYO, Oct 7, 2022 - (JCN Newswire) - NEC Corporation (TSE: 6701) will launch the new "SX-Aurora TSUBASA C401-8"
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GUC announces GLink-3D Die-on-Die interface IP Global Unichip (GUC), an ASIC developer, has announced GLink-3D die-on-die interface IP using TSMC's N5 and N6 processes and 3DFabric advanced packaging technology for AI, HPC, and networking applications. With AI, HPC and networking memory demand growing there is a need for SRAM/Logic disintegration allowing the implementation of separate SRAM and Logic at the most efficient process nodes. Layers of CPU and SRAM (Last Level Cache, packet buffers) dies can be assembled over and under interconnect/IO dies using TSMC's 3DF...
05/24/2021 | Press release | Distributed by Public on 05/24/2021 00:14 GUC Announces GLink-3D Die-on-Die Interface IP using TSMC N5 and N6 Process for 3DFabric⢠Advanced Packaging Technology Hsinchu, Taiwan - May 24, 2021 - Global Unichip Corp. (GUC), the Advanced ASIC Leader, announces GLink-3D die-on-die interface IP using TSMC's N5 and N6 processes and 3DFabricâ¢advanced packaging technology for AI, HPC, and Networking applications. AI/HPC/Networking memory demand is growing quickly and the SRAM to Logic ratio is also increasing. Logic gains higher density and performance when sca...
Apr 5, 2021 12:04 EDT AMD has published a new patent in which the company talks about an active chiplet serving as a bridge between multiple GPU dies, possibly based on its next-generation RDNA 3 architecture for GPUs and APUs. AMD Active Bridge Chiplet Patent Might Give Us A Glimpse of The Next-Gen RDNA 3 Graphics Architecture Based GPUs and APUs The patent starts off by stating the elephant in the room and that's conventional monolithic GPU designs. We all know how well chiplets worked out for AMD in the CPU segment & the company is now planning to follow the same route on the GPU side...