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Cadence Extends Collaboration with TSMC and Microsoft to Advance Giga-Scale Physical Verification in the Cloud

Highlights:

Enables customers to effectively leverage the Cadence Pegasus Verification System and TSMC technology on the Microsoft Azure cloud with the Cadence CloudBurst Platform

Initial. | April 17, 2023 ....

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Cadence Extends Collaboration with TSMC and Microsoft to Advance Giga-Scale Physical Verification in the Cloud

Cadence Extends Collaboration with TSMC and Microsoft to Advance Giga-Scale Physical Verification in the Cloud
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New Electronics - 3D-IC hybrid bonding reference flow collaboration

United Microelectronics, a global semiconductor foundry, and Cadence Design Systems, have announced that the Cadence 3D-IC reference flow, featuring the Integrity 3D-IC Platform, has been certified for UMC’s chip stacking technologies. ....

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UMC and Cadence Collaborate on 3D-IC Hybrid Bonding Reference Flow

UMC and Cadence Collaborate on 3D-IC Hybrid Bonding Reference Flow
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New Electronics - Cadence design flows achieve certification for TSMC's N4P and N3E processes

Cadence Design Systems has announced that TSMC has certified its digital and custom/analogue design flows for the latest TSMC N4P and N3E processes in support of the new Design Rule Manual (DRM) and FINFLEX technology. ....

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