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The development trend of printed circuit board products and Kinwong's solution With the rapid development of electronic technology in recent years, printed circuit board (PCB) products are pursuing higher heat dissipation capabilities, with high voltage and high current characteristics, and are developing towards high-density interconnection technology (HDI). Kinwong is a PCB manufacturer headquartered in Shenzhen, China, with 28 years of manufacturing experience and ranks 20th in the PCB industry globally. Kinwong has Multiple Technology Capabilities, such as PCB, FPCB, MPCB, SLP, HLC. The p...

The development trend of printed circuit board products and Kinwong's solution With the rapid development of electronic technology in recent years, printed circuit board (PCB) products are pursuing higher heat dissipation capabilities, with high voltage and high current characteristics, and are developing towards high-density interconnection technology (HDI). Kinwong is a PCB manufacturer headquartered in Shenzhen, China, with 28 years of manufacturing experience and ranks 20th in the PCB industry globally. Kinwong has Multiple Technology Capabilities, such as PCB, FPCB, MPCB, SLP, HLC. The p...

MORFRAC and 3D Printing - A Success Story © MORFRAC In recent years, 3D printing has revolutionised manufacturing processes. Expiring patents have caused 3D printing costs to plunge and quality to soar, granting opportunities for small-scale manufacturers to experiment - and excel - with 3D printing. We spoke to Nicolas Goldenberg, founder of Morfrac Systems, to discuss how 3D printing has contributed to the success of their iconic product, the morfblock. "We started experimenting with 3D printing in 2015. Since then, me and the Morfrac team put a lot of time into it. At some poi...

With the rapid development of electronic technology in recent years, printed circuit board (PCB) products are pursuing higher heat dissipation capabilities, with high voltage and high current characteristics, and are developing towards high-density interconnection technology (HDI).

With the rapid development of electronic technology in recent years, printed circuit board (PCB) products are pursuing higher heat dissipation capabilities, with high voltage and high current characteristics, and are developing towards high-density interconnection technology (HDI).