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Q&A Summary : Functional Products business (IR Business Briefing)

Q&A Summary of the IR Business Briefing of Furukawa Electric Co., Ltd.

Date: June 9, 2023 14:45-15:45

Contents: Functional Products. | June 20, 2023 ....

South Korea , South Korean , Takashi Saito , Shozo Yano , Akihiro Fukunaga , Masaki Ishikawa , Accounting Division , Memory Disk Division , Management Solution Products Division Takashi Mori , Plastics Division , Copper Foil Division , Planning Administration Department , Products Division , Functional Products , Corporate Senior Vice President , General Manager , Functional Products Division , Corporate Vice President , Thermal Management Solution , Products Division Takashi Mori , Administration Department , South Koreanmanufacturers ,

Company discovers ingenious new process that could double the lifespan of lithium-ion batteries for EVs

“Röchling is always looking for the next stage in the evolution of electric vehicles and to support safety and sustainability goals." ....

United States , Marco Barbolini , International Energy Agency , Thermal Management Solution , South American , Global Product Manager ,

Investegate |Cooper Standard Announcements | Cooper Standard: Cooper Standard's Thermoplastic Thermal Management Solution for Battery Electric Vehicles Wins SPE® Automotive Innovation Award

Investegate announcements from Cooper Standard, Cooper Standard’s Thermoplastic Thermal Management Solution for Battery Electric Vehicles Wins SPE® Automotive Innovation Award ....

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Cooper Standard's Thermoplastic Thermal Management Solution for Battery Electric Vehicles Wins SPE® Automotive Innovation Award

DJ Cooper Standard's Thermoplastic Thermal Management Solution for Battery Electric Vehicles Wins SPE® Automotive Innovation Award Cooper Standard Cooper Standard's Thermoplastic Thermal Management ....

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Evertiq - The development trend of printed circuit board products a...

With the rapid development of electronic technology in recent years, printed circuit board (PCB) products are pursuing higher heat dissipation capabilities, with high voltage and high current characteristics, and are developing towards high-density interconnection technology (HDI). ....

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