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Cadence Integrity 3D-IC Platform Supports TSMC 3DFabric Technologies for Advanced Multi-Chiplet Designs

Highlights: ● The Cadence 3D-IC solution centers on the Integrity 3D-IC platform, which provides integrated planning, implementation and system analysis to optimize PPA for multi-chiplet systems ● The Tempus Timing Signoff Solution with inter-die analysis and STA technologies results in faster time to tapeout ● The Voltus IC Power Integrity Solution, tightly coupled with the… ....

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Cadence Integrity 3D-IC Platform Supports Advanced Multi-Chiplet Designs

Cadence Integrity 3D-IC Platform Supports Advanced Multi-Chiplet Designs
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Cadence Integrity 3D-IC Platform Supports TSMC 3DFabric™ Technologies for Advanced Multi-Chiplet Designs – Consumer Electronics Net

Cadence Integrity 3D-IC Platform Supports TSMC 3DFabric™ Technologies for Advanced Multi-Chiplet Designs – Consumer Electronics Net
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Cadence Digital, Custom/Analog Flows Achieve the Latest TSMC N3 and N4 Certifications

Cadence Digital, Custom/Analog Flows Achieve the Latest TSMC N3 and N4 Certifications
iconnect007.com - get the latest breaking news, showbiz & celebrity photos, sport news & rumours, viral videos and top stories from iconnect007.com Daily Mail and Mail on Sunday newspapers.

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Cadence Accelerates System Innovation with Breakthrough Integrity 3D-IC Platform

Highlights: • Integrity 3D-IC integrates design planning, implementation and system analysis in a single, unified cockpit • Designers can achieve system-driven PPA through the availability of integrated thermal, power and static timing analysis capabilities • Cadence’s third-generation 3D-IC solution supports a wide range of application areas including, hyperscale computing, consumer, 5G communications, mobile and automotive… ....

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