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Accelerated intelligent SoC development with on-device AI platform

Accelerated intelligent SoC development with on-device AI platform
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Sanjive Agarwala , Tensilica Dsps , Ip Group At Cadence , Cadence Design Systems , இப் குழு இல் கேடென்ஸ் , கேடென்ஸ் வடிவமைப்பு அமைப்புகள் ,

Cadence Announces New Low-Power IP for PCI Express 5.0 Specification on TSMC N5 Process


Cadence Announces New Low-Power IP for PCI Express 5.0 Specification on TSMC N5 Process
Cadence Design Systems, Inc. announced immediate availability of Cadence® IP supporting the PCI Express® (PCIe®) 5.0 specification on TSMC N5 process technology. The next follow-on version on TSMC N3 process technology is expected to be taped out in early 2022. Collaboration with major customers is ongoing for N5 SoC designs targeting hyperscale computing and networking applications. The Cadence IP for PCIe 5.0 technology consists of a PHY, companion controller and Verification IP (VIP) targeted at SoC designs for very high-bandwidth hyperscale computing, networking and storage applications. With Cadence’s PHY and Controller Subsystem for PCIe 5.0 architecture, customers can design extremely power-efficient SoCs with accelerated time to market. ....

Al Yanes , Suk Lee , Sanjive Agarwala , Tom Fawcett , Lab Production Business Unit , Design Infrastructure Management Division , Cadence Design Systems Inc , Ip Group At Cadence , Design Systems , Controller Subsystem , Compute Express Link , Production Business Unit , Intelligent System Design , சூக் லீ , டோம் ஃபாஸிட் , வடிவமைப்பு உள்கட்டமைப்பு மேலாண்மை பிரிவு , கேடென்ஸ் வடிவமைப்பு அமைப்புகள் இன்க் , இப் குழு இல் கேடென்ஸ் , வடிவமைப்பு அமைப்புகள் , கணக்கிடு எக்ஸ்பிரஸ் இணைப்பு , ப்ரொடக்ஶந் வணிக அலகு , புத்திசாலி அமைப்பு வடிவமைப்பு ,

Third-generation 112G-LR SerDes IP


Third-generation 112G-LR SerDes IP
Cadence Design Systems has unveiled its third-generation 112G long-reach (112G-LR) SerDes IP on TSMC’s N5 process, targeting hyperscale ASICs, AI/ML accelerators, and switch fabric systems on chip (SoCs).
The new architecture offers 25% power savings, 40% area reduction and better design margins over the second-generation architecture, and looks to address the increasing needs for higher performance and power efficiency in modern next-generation cloud data centres.
Cadence has enabled different variances of PAM4 SerDes supporting XSR, VSR, MR and LR interconnect standards and through a combination of design wins and collaborations with leading hyperscale and data centre customers, has been able to incorporate specific enhancements in the third-generation product and currently has N5 test chips in-house that are undergoing characterization. ....

Sanjive Agarwala , Ip Group At Cadence , Cadence Design Systems , Design Systems , Serdes Ip , இப் குழு இல் கேடென்ஸ் , கேடென்ஸ் வடிவமைப்பு அமைப்புகள் , வடிவமைப்பு அமைப்புகள் ,