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University of Louisville selects Oxford Instruments Plasma Technology's deep silicon etch solutions for leading edge research

University of Louisville selects Oxford Instruments Plasma Technology's deep silicon etch solutions for leading edge research
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Nanotechnology Now - Press Release: GLOBALFOUNDRIES Moves Corporate Headquarters to its Most Advanced Semiconductor Manufacturing Facility in New York

Nanotechnology Now - Press Release: GLOBALFOUNDRIES Moves Corporate Headquarters to its Most Advanced Semiconductor Manufacturing Facility in New York
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Nanotechnology Now - Press Release: Knowledge and Power: Oxford Instruments Plasma Technology and LayTec join forces to provide critical front end processing solutions for the production of compound semiconductor devices

Nanotechnology Now
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Home > Press > Knowledge and Power: Oxford Instruments Plasma Technology and LayTec join forces to provide critical front end processing solutions for the production of compound semiconductor devices
Abstract:
Two technology leaders within the compound semiconductor industry, Oxford Instruments Plasma Technology and LayTec announce an exclusive collaboration agreement to enable the next generation requirements of advanced semiconductor devices in the high-volume manufacturing (HVM) environment. The partnership aims to develop and integrate LayTecs accuracy and control with Oxford Instruments renowned wafer processing expertise.
Together, they will combine plasma process solutions with proven in-situ metrology to achieve next generation device performance and enable a repeatable HVM process to shorten customers yield ramp. LayTec will develop the in-situ metrology while Oxford Instruments will integrate LayTe ....

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Oxford Instruments Plasma Technology Helps Drive Commercialization of 2D Devices with the European Graphene Flagship Funded Pilot Line

Oxford Instruments Plasma Technology Helps Drive Commercialization of 2D Devices with the European Graphene Flagship Funded Pilot Line
Oxford Instruments Plasma Technology, a leading supplier of plasma processing solutions for high volume manufacturing and research and development (R&D), is pleased to announce its involvement in the European Graphene Flagship funded “2D Experimental Pilot Line”.
Leading European semiconductor foundries and research institutions are working together to create the world’s first manufacturing line to bring two-dimensional (2D) materials enhanced semiconductor technologies from the laboratory into commercial devices.
Oxford Instruments is proud to be the exclusive Atomic Layer Deposition (ALD) hardware and process solution partner in this cross-European collaboration, continuing its strategy of working with innovative global partners to translate leading research into the manufacturing environment, driving improvements in device perf ....

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Nanotechnology Now - Press Release: 180 Degree Capital Corp. to Report Fourth Quarter 2020 Financial Results on Monday, February 22, 2021 and to Host a Conference Call on Tuesday, February 23, 2021

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Home > Press > 180 Degree Capital Corp. to Report Fourth Quarter 2020 Financial Results on Monday, February 22, 2021 and to Host a Conference Call on Tuesday, February 23, 2021
Abstract:
180 Degree Capital Corp. (NASDAQ: TURN) will announce its fourth quarter 2020 financial results on Monday, February 22, 2021, shortly after the close of the public markets. It will host a conference call on Tuesday, February 23, 2021, at 9am Eastern Time to discuss these results and updates from Q1 2021.
180 Degree Capital Corp. to Report Fourth Quarter 2020 Financial Results on Monday, February 22, 2021 and to Host a Conference Call on Tuesday, February 23, 2021
Montclair, NJ | Posted on February 19th, 2021 ....

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