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SMT Placement Equipment Market to Grow by USD 627.46 Million During 2021-2025|Key Vendor Insights and Forecasts


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NEW YORK, April 15, 2021 /PRNewswire/
The SMT placement equipment market is expected to grow by USD 627.46 million during 2021-2025, according to the new report from Technavio. This marks a significant market slow down compared to the 2020 growth estimates due to the impact of the COVID-19 pandemic, in the first half of 2020. In addition, the report projects the market to accelerate at a CAGR of about 6%.
Technavio has announced its latest market research report titled SMT Placement Equipment Market by End-user and Geography - Forecast and Analysis 2021-2025
Make confident decisions using our benchmarks and analysis.
Read the 120-page report with TOC on SMT Placement Equipment Market Analysis Report by End-user (Consumer Electronics, Automotive, Telecom, and Others) and Geography (APAC, Europe, North America, MEA, and South America), and the Segment Forecasts,2021-2025 . Gain competitive intelligence about market leaders. Track key indust ....

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Die Bonder Equipment Market to grow by $ 78.36 Million | COVID-19 Impact Analysis, Key Drivers, Trends, and Products Offered by Major Vendors


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NEW YORK, April 6, 2021 /PRNewswire/
The global die bonder equipment market is expected to grow by USD 78.36 million, exhibiting a CAGR of almost 2% during 2021-2025, according to Technavio s latest market report. Based on our research, the
semiconductor equipment sector witnessed a
mixed impact due to the widespread growth of the COVID-19 pandemic. The report also throws light on the pre- and post-impact of COVID-19 on businesses.
Technavio has announced its latest market research report titled Die Bonder Equipment Market by End-user and Geography - Forecast and Analysis 2021-2025
The OSATs segment will generate maximum revenue in the die bonder equipment market, owing to the need for a rise in the production capacity and constant technological innovations in semiconductor packaging techniques. In terms of geography, APAC will present significant opportunities for market vendors due to the growing production of smartphones, tablets, ....

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Hong Kong take-private deals set to pick up pace after hitting three-year high in 2020


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HONG KONG (Reuters) - Deals to take Hong Kong-listed companies private are set to accelerate next year, having already hit a three-year peak in 2020, as family-owned and other businesses reel from economic downturn amid the COVID-19 pandemic, bankers and investors said.
FILE PHOTO: A Star Ferry boat crosses Victoria Harbour in front of a skyline of buildings during sunset. Hong Kong, China June 29, 2020. REUTERS/Tyrone Siu/File Photo
Private equity firms with billions of dollars to spend are also expected to keep hunting for targets in the Asian financial hub, they said, making them attractive as partners for some tycoons to take their firms private. ....

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