Page 6 - Hips Components News Today

Taiwans semiconductor supply chain has "fine-tuned" production plans for a major artificial intelligence (AI) chip client in order to satisfy demand in time, according to industry sources.

Advanced Semiconductor Engineering (ASE) has announced its latest fan-out-chip-on-substrate-bridge (FOCoS-Bridge) technology innovation, which involved qualifying a large 70x78mm package containing two ASICs and eight HBM devices connected by eight silicon bridges.

Kioxia has begun operating two new R&D facilities in Japan - the Flagship Building at the Yokohama Technology Campus and the Shin-Koyasu Technology Front - bolstering the companys R&D capabilities in flash memory and solid-state drives (SSD), according to the company. In the future, other R&D functions in Kanagawa Prefecture will be relocated to these new R&D centers in order to increase research efficiency and advance technological innovation.

Broadcom said it also hopped on the bandwagon of the AI boom, predicting its AI revenue share would more than double in the coming years.

MediaTek is partnering with Nvidia to boost its competitiveness in the automotive IC market versus Qualcomm, but Qualcomm believes its extended deployment in the industry will keep it competitive.

Incorporating AI into audio ICs is gaining traction and is becoming increasingly necessary for PC applications as hybrid work models become a norm and notebook requirements increase, said Cirrus Logic

Samsung Electronics has announced on June 2 its participation as a steering board member in the RISC-V Software Ecosystem (RISE) project initiated by the Linux Foundation Europe. The new project, launched on May 31, aims to foster collaboration among software and hardware vendors to expedite the availability of high-performance and power-efficient RISC-V cores running advanced operating systems for diverse market segments. Apart from Samsung, participants of the project include Andes, Google, In...

PCB maker Apex International expects to post a 20-30% revenue increase in 2024, with increased sales of automotive boards to serve as the growth driver.

Keysight Technologies, dedicated to supplying electronics test/measurement equipment and software, has recently become a member of the TSMC Open Innovation Platform (OIP) 3D Fabric Alliance formed to accelerate 3D IC ecosystem innovation and readiness. The membership will allow the US vendor to utilize the TSMC 3Dblox standard to develop electronic design automation (EDA) software and testing solutions.

In line with the mega trend of intelligence and edge AI applications, Taiwans MCU makers are focusing on the development of MCUs integrated with AI to explore the AI MCU business opportunities and create more new edge AI markets and applications, according to industry sources.